None
● Mature exposure optical system, high-quality and high-precision exposure, up to 1μm lithography resolution.
● Using a self-developed parallel adjustment mechanism, the proximity gap between the mask and Wafer can be set with high precision.
● The optional bottom alignment function is better than ±2 μm.
● High production beat, our have a senior automation team to realise the industry-leading equipment production capacity efficiency.
● Customised carrying capacity for ultra-thin, fragile, warped or transparent wafers.
● A large number of additional functions and customised functions can meet diversified process requirements, and can also realise fully automatic AGV / In-Line production methods.
| Performance name | Technical indicators |
| Wafer size | 2”-6” |
| Wafer thickness | 200um～750um |
| Exposure mode | Soft contact, hard contact, vacuum exposure |
| Resolution | 3um |
| Counterpoint accuracy | 0.8um |
Contact Us
Scan code follow us
Home
