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● Adopt high-power exposure light source design.
● High-precision imaging and positioning system, the alignment accuracy is better than ±10μm.
● Large depth of field design to effectively ensure product production consistency.
● Target learning function, suitable for a variety of targets.
● A variety of rise and shrinkage modes.
● Fully automatic wired production.
| Performance name | Technical indicators |
| Substrate size | ≤630*730mm |
| Type of table | Double table |
| Number of lenses | 12 |
| Green ink Bridge | 50um |
| Solder Mask Opening | ≥75um |
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